| Sinters W/Cu base (infiltrated materials) | |||||||||
| Code | Composition % |
Density g/cm3 |
Conductibility % IACS |
Thermal Conduct. w/mk |
Brinell Hardness 2,5 - 187,5 |
Rockwell hardness Diamond Kg. 60 HR A |
Powder grading µM |
Softening temperature °C |
Thermal expansion coeff. 10-6 1/°C |
| K0/0 | 70 W - 30 Cu | 14,20 - 14,40 | 50 - 55 | 210 | 180 - 190 | 55 - 56 | 4 - 6 µ | 920 | 11 |
| K0/1 | 75 W - 25 Cu | 14,85 - 15,05 | 46 - 50 | 200 | 200 - 210 | 57 - 58 | 4 - 6 µ | 940 | 10 |
| K0/2 | 77 W - 23 Cu | 15,15 - 15,40 | 44 - 46 | 190 | 210 - 220 | 58 - 59 | 4 - 6 µ | 960 | 8 |
| K0/3 | 80 W - 20 Cu | 15,50 - 15,70 | 43 - 45 | 185 | 210 - 225 | 58 - 59,5 | 4 - 6 µ | 980 | 7 |
| Sinters W/Ag base (infiltrated materials) | |||||||||
| Code | Composition % |
Density g/cm3 |
Conductibility % IACS |
Thermal Conduct. w/mk |
Brinell Hardness 2,5 - 187,5 |
Rockwell hardness Diamond Kg. 60 HR A |
Powder grading µM |
Softening temperature °C |
Thermal expansion coeff. 10-6 1/°C |
| WG2 | 70 W - 30 Ag | 15,20 - 14,40 | 55 - 58 | 180 | 170 - 180 | 53,5 - 55 | 4 µ | 800 | 11 |
| WG3 | 80 W - 20 Ag | 16,30 - 16,50 | 46 - 48 | 157 | 220 - 230 | 59 - 60 | 4 µ | 900 | 8 |
| WG4 | 75 W - 25 Ag | 15,70 - 15,90 | 53 - 55 | 167 | 200 - 210 | 57 - 58 | 4 µ | 850 | 10 |